hb-fuller

Permasil 909C | Carnauba Wax Mold Release Spray

• Carnauba wax Mold Release Spray
• Solvent-based, non-flammable
• Compatible with Epoxy Mold Compound

PIT1A-ESD | 1mil Antistatic ESD Polyimide (Kapton) Tape with Acrylic Adhesive

• 1 mil polyimide film
• Acrylic adhesive
• >6000V breakdown voltage

LINQALLOY Bi57Sn42Ag1 | Near-Eutectic Pbfree Solder Spheres

• Leadfree Solder Spheres
• 1% Agg adds mechanical strength to bismuth-tin alloy
• Low-temperature near-eutetic Solder

NanoClear Fluxophobic Stencil Treatment Wipes

• Best-in-class stencil treatment technology
• Better quality printing
• Reduce underside cleaning

Metal Repellency Treatment

• Renders metal surfaces hydrophobic/oleophobic
• 2-4 nm thickness
• Repellent to nearly any liquid

Glass Repellency Treatment

• For making glass surfaces hydrophobic and oleophobic
• 2-20 nm thickness
• Easy to apply, optically clear and ultra thin

Multi Surface Hydrophobic Treatment

• General purpose hydrophobic treatment
• 20-100 nm thickness
• Repels most aqueous liquids

Multi Surface Oleophobic Treatment

• General purpose hydrophobic/oleophobic treatment
• 30 - 300 nm thickness
• Reduces surface friction

NanoProof 1.0 PCB Waterproofing Surface Treatment

• Provides basic protection for accidental water damage
• 10-100 nm thickness
• IPX3

NanoProof 5.1 PCB Waterproofing Surface Treatment

• Hydrophobic/Oleophobic treatment
• 6-9 µm thickness
• IPX5

905 Specialty Cleaner

• Water based specialty cleaner
• Enhances adhesion of Aculon coatings
• For almost all metallic and oxide containing surfaces

NanoProof 5.0 PCB Waterproofing Surface Treatment

Solder Sphere Tape & Reel Packaging

• Suitable for BGA and flip chip packaging techniques
• Available for our complete range of solder sphere alloys and diameters
• Compatible with almost all existing pick and place feeders

MCL-C10 | Melamine Compression Cleaning Material

• 0.07% Formaldehyde
• Compression grade
• Suitable for transfer mold equipment

RCS 320 | Rubber Cleaning Sheets

• Optimal cleaning performance
• Good flow characteristics
• No mold abrasion

SAC305 on 13" Tape & Reel

• Lowest cost Sn/Ag/Cu alloy on tape & reel
• Suitable for BGA and flip chip packaging techniques
• Compatible with almost all existing pick and place feeders

MCL-C11 | Melamine Compression Cleaning Tablets

• 3.6% Formaldehyde
• Compression Grade
• Suitable for EMC

BMI-689 Low Viscosity Liquid Bismaleimide

• Hydrophobic
• High adhesion to various substrates
• Superior thermal stability

SAC305 on 7" Tape & Reel

• SAC 305 on 7 in Tape & Reel
• Designed for Pick & Place
• Available for all sizes of solder spheres

NanoProof 2.1 PCB Waterproofing Surface Treatment

• Hydrophobic treatment
• 30-50 μm thickness
• IPX7, IPX8

BMI-3000 CG Low Cost Bismaleimide (Imide Extended) in Powder Form

• Superior thermal stability
• High adhesion to various substrates
• Hydrophobic toughener

BMI-1400 Low Viscosity Bismaleimide Oligomer

• Soluble in many reactive diluents
• High adhesion to various substrates
• Superior thermal stability

BMI-1500 Low Molecular Weight Bismaleimide Oligomer

• Soluble in many reactive diluents
• High adhesion to various substrates
• Superior thermal stability

BMI-1700 Amorphous, Low Molecular Weight Bismaleimide Oligomer

• Soluble in many reactive diluents
• High adhesion to various substrates
• Superior thermal stability

BMI-5000 P Imide-extended Bismaleimide Oligomer

• Additive to enhance toughness in thermoset compositions
• Cures to a tough thermoset
• Low cross-link density

BMI-6000 Imide-extended Bismaleimide Oligomer

• Superior thermal stability
• Good dielectric properties
• Toughener

BMI-3000 Gel Bismaleimide (Imide Extended)

• Superior thermal stabilty
• Hydrophobic
• Toughener

BMI-3000 J Bismaleimide (Imide Extended) in Powder Form

• Superior thermal stability
• High adhesion to various substrates
• Hydrophobic toughener

NanoClear Test Pen

• Best-in-class stencil treatment technology
• Simple and effective test
• No training required

NanoProof 8.4 PCB Waterproofing Surface Treatment

• Hydrophobic treatment
• Application dependent thickness
• Adheres to multiple substrates

CHEMLINQ MRE-C909 | Carnauba Wax Mold Release Spray

• Alternative to MJ Gordon #909C
• Carnauba wax mold release Spray
• Compatible with Epoxy Mold Compound

AcuWet ON-470 Hydrophilic coating

• Provides a hydrophilic coating
• Excellent chemical bonding to many surfaces
• Easy to apply

EC Nanoscale Epoxy control

• Eliminating Die Attach Epoxy bleed
• Epoxy control in Semiconductor packaging
• Excellent chemical bonding to many surfaces

LOCTITE ABLESTIK 8008

• Snap curable after B stage
• Low modulus
• Void free bondline without bleed

LOCTITE ABLESTIK ABP 8068TB

• Good workability
• High thermal stability
• Solder replacement

LOCTITE ABLESTIK ABP 8068TA

• Excellent workability
• Dispensable
• Printable

LOCTITE ABLESTIK SSP 2020

• High thermal conductivity
• High electrical conductivity
• High die shear strength

LOCTITE 3128

• One component
• Low temperature cure
• Bonding heat sensitive components

MCN-T20 | Transfer-Grade Wax Conditioning Pellets

• Wax Compound
• Filling deep cavities
• Transfer Molding

MCL-C12 | Melamine Compression Cleaning Tablets

• 1.7% Formaldeheyde
• Compression Grade
• Suitable for Semiconductor EMC

TIP 1500 | Thermal insulator pad

• 0.54 - 0.61 Thermal Impedance
• 1.5 Thermal Conductivity
• 0.23mm Thickness

TIP 3500 | Thermal insulator pad

• 0.18 - 0.23 Thermal Impedance
• 3.5 Thermal Conductivity
• 0.25 - 0.50 mm Thickness

HT 3500 | One part Hybrid Thermal Gel

• Dark Red
• 3.5 Thermal Conductivity
• High flow rate

LOCTITE ECCOBOND LUX OGR150THTG

• Non conductive
• Photocurable
• Cures in shadowed areas

A1050 | Anti bleed Additive

• Silver filled systems
• 100 mPa-s Viscosity
• Non halogenated

HLT 2000 | Two part Hybrid Thermal Gel

• Yellow + White
• 2.0 Thermal Conductivity
• Cost Effectiveness

TG 2000I | Thermal Grease

• 0.02 Thermal Impedance
• 2.0 Thermal Conductivity
• 30μm BLT

LTM 6300-SP | Phase Change Paste

• 0.12 - 0.14 Thermal Impedance
• 1.8 - 2.4 Thermal Conductivity
• Highest volume resistivity

Sn63Pb37 on 13" Tape & Reel

• Sn63Pb37 alloy on tape & reel
• Suitable for BGA and flip chip packaging techniques
• Compatible with almost all existing pick and place feeders

BMI-3000-C | Gel Catalyzed Bismaleimide oligomer

• Precatalyzed
• Toughener
• Hydrophobic

BMI-2500 | Imide extended Bismaleimide powder

• Hydrophobic
• Toughener
• Increased modulus and Tg

LINQCELL GDP180 | 180um Carbon Paper

• 0.18 mm - 180 um - 7 mil
• Alternative to Spectracarb 0850
• Gas diffusion layer and electrode

LPK-20 | LINQPAK Blue Ice Shipping pack

• Outer Box
• 3 layer insulation foil
• Double Foam Barrier

LOCTITE ABLESTIK 16-1LV

• Two components
• Room temperature cure
• Low volume resistivity

LOCTITE SI 5404

• Electrical isolation
• Thermally conductive
• Bond metallic heat sinks

LOCTITE SI 5140

• Non corrosive
• Room temperature vulcanization
• Alkoxy Silicone

LOCTITE SI 5145

• Non corrosive
• Room temperature vulcanization
• No slumping

LOCTITE SF 7387

• Activator
• Very low viscosity
• Promote cure of acrylic adhesives

Bi58Sn42 on 7" Tape & Reel

• Bi58Sn42 on 7 in Tape & Reel
• Designed for Pick & Place
• Available for all sizes of solder spheres

Bi58Sn42 on 13" Tape & Reel

• Bi58Sn42 on 13inch Tape & Reel
• Suitable for BGA and flip chip packaging techniques
• Compatible with almost all existing pick and place feeders

PEMION - PF1-HLF8-15

• PFAS-free Proton Exchange Membrane with Hydrocarbon reinforcement
• 15 µm thickness
• Optimized for heavy duty fuel cell applications

SAC305 Solder Preforms on Tape & Reel

• SAC 305 on Tape & Reel
• Designed for Pick & Place
• Available for all sizes of solder spheres

WS810 | Wax Conditioning Sheets

• High flow
• Excellent elastic properties
• Homogeneous waxing

LOCTITE 3619

• SMD components on PCB
• Chipbonder
• Very High dispense speed

LOCTITE ABLESTIK 8370C

• Gold Filled
• High electrical conductivity
• Works on Noble finished substrates

FM-0411P | Reactive PDMS - Monoterminal Hydroxy

• Mono terminal
• 1,000 g/mol | 15 mPas
• Hydroxy functional group

TIP 5000 | Thermal insulator pad

• 0.15 - 0.18 Thermal Impedance
• 5.0 Thermal Conductivity
• 0.25 - 0.50 mm Thickness

XVCF-XS50P | LINQSTAT - 50 Ω/sq Conductive Film

• 2.6 mil - 2.75mil
• ±50 Ohms/sq Surface resistivity
• Polyurethane film

LOCTITE ABLESTIK 550K

• Low cure temperature
• Hard to bond metals
• Thermally conductive

LOCTITE ECCOBOND F113SC

• Two component
• High Tg
• Fiber optic assembly

LINQCELL CF350 | 350um Carbon Fabric

• 0.35mm - 350um - 14mil
• Comes in roll form
• 5 TP Resistance

LINQCELL CF400-MP | 400um Carbon Fabric

• 0.4mm - 400um - 16mil
• Comes in roll form
• 13 TP Resistance

LOCTITE 401

• Instant adhesive
• Very high adhesion strength
• Bond dissimilar substrates

LOCTITE ECCOBOND LUX OGRFI146T

• Low refractive index
• Photocurable
• Cures in shadowed areas

LINQSOL EMC-7560 | Black Epoxy Mold Compound

• High Glass Transition Temperature (205 °C)
• Designed for high voltage, high power discrete packages
• New Epoxy System To Pass HTRB Tests

Copper Core SAC305 on 13" Tape & Reel

• Copper core Sn/Ag/Cu alloy on tape & reel
• Suitable for BGA and flip chip packaging techniques
• Compatible with almost all existing pick and place feeders

LOCTITE ABLESTIK NCA 2350

• Fast cure
• Good adhesion
• Heat sensitive components

Aculon Nanoproof 3-001X

• 0.1% Fluoroacrylate Solids
• 1 um Thickness
• 3M Novec 1720 replacement

A6165 | Electrical conductivity Enhancer

• Improves electrical conductivity
• Soluble in most resin systems
• May improve thermal conductivity

MCP-5260 | Motor Coating Powder

• Light Green Color
• Good Edge Coverage
• Insulation Class F

PEM-665 | Methacrylate terminated polyester

• Low color
• Low shrinkage
• Thermal stability

DMI-3850 | Low Outgassing Adhesive

• UV Cure
• Space applications
• Virtually no outgassing

OLS-1000HF | Liquid Encapsulant - Two part Epoxy

• Liquid epoxy encapsulant
• LED applications
• Low Halogen

HW-HSPS | Heat Spreader - Progressive Stamping

• Nickel plated / Au Spot
• Small and medium form factors
• Simplified parts - Lower volumes

HW-HSTD | Heat Spreader - Transfer die stamping

• Nickel plated / Au Spot
• Wide range form factor
• Complex designs - Higher volumes

OPTOLINQ BMC-1100| Black Mold Compound

• Black
• Excellent heat resistance
• Long spiral flow

JNC PI-6643-004 | Insulating Polyimide Ink

• Thermal Curable
• High Heat Resistance
• Inkjet Printing

JNC PI-6302-004 | Insulating Polyimide Ink

• Thermal Curable
• Low Temperature Curing
• High Heat Resistance

JNC PI-6322-001 | Insulating Polyimide Ink

• Thermal Curable
• Heat Resistance
• Low Temperature Curing

JNC PI-6673-002 | Insulating Polyimide Ink

• Thermal Curable
• Low Temperature Curing
• Low Warpage

JNC PA-1210-020 | Insulating Polyacrylate Ink

• UV Curable/ Solvent free
• Standard
• Optoelectronics

JNC PA-1210-034 | Insulating Polyacrylate Ink

• UV Curable/ Solvent free
• High Insulation reliability for fine pitch devices
• Advance Sensors

JNC PA-1210-035 | Insulating Polyacrylate Ink

• UV Curable/ Solvent free
• High Insulation reliability for thin film devices
• Optical Devices

OLS-1305 | Liquid Encapsulant - Two part Epoxy

• Extremely low viscosity
• Rapid cure at moderate temperatures
• Excellent mechanical properties

OLS-1557 | Liquid Encapsulant - Two part Epoxy

• Low viscosity
• Good workability
• High temperature resistance

FM-0815J | Reactive PDMS - Monoterminal Alkoxysilyl

• Mono terminal
• 3,000 g/mol | 26 mPas
• Alkoxysilyl functional group

Hysol GR720 | Black Epoxy Mold Compound

• High reliability
• Green and halogen-free
• Designed for SOT applications

Hysol KL1000-3LX | Black Epoxy Mold Compound

• High reliability
• High moldability
• Decreased cost-of-use

COOLINQ SG-25 | Graphite heat spreader

• 25um Graphite
• Light weight and flexible
• Excellent thermal conductivity

COOLINQ SG-90 | Graphite Heat Spreader

• 90um Graphite
• Light weight and flexible
• Excellent thermal conductivity

JNC PA-1510-003| Insulating Polyacrylate

• UV curable
• Heat Resistance
• Removable process material

JNC PA-1510-005| Insulating Polyacrylate

• UV curable
• Dissolutes in 5 minutes
• Removable process material

OLS-3712 | Liquid encapsulant - Two part silicone

• low-temperature resistance
• Excellent thermal and light resistance
• Excellent adhesion to various materials

OLS-5812 | Liquid encapsulant - Two part silicone

• High reliability
• Excellent thermal and light resistance
• Excellent adhesion to different materials

RD-A primer | Isopropanol solvent

• Provides basic protection for accidental water damage
• Coating Thickness 5-100 nm
• For coatings that react with metal alkoxide functional groups

Aculon HB | Hydrophilic Treatment

• Used as provided for wipe applications
• Use for dip treatment applications
• Gentle enough for many substrates.

LOCTITE EDAG 452SS E&C

• Screen printable
• Fast UV cure
• Excellent adhesion

SACQ | Pb-free Solder Spheres

• Leadfree Solder Spheres
• Excellent Solder Joint Reliability for small devices
• Excellent fatigue resistance

OPTOLINQ LE-5031 | Two part epoxy resin

• Low viscosity
• High transparency
• Excellent solvent, aging, and thermal resistance

AEMION+™-AF3N-HWC9-75

• Recommended for AEM Water Electrolysis, Acid Recovery, and Salt Splitting
• Single-Step Activation for Reduced Membrane Processing Time
• 75-µm thick membrane with woven PEEK reinforcement

LOCTITE EDAG 456

• Non conductive
• screen printable
• Thermoformable

LOCTITE ECI 8001 E&C

• Rapid heating with fast, defined cut-off temperatures, no external control devices needed
• Printable on most common substrates
• Screen printable

OPTOLINQ GT-W170MG | White Epoxy Mold Compound

• High light reflectance and excellent light shielding
• Low yellowing at high temperature
• High MSL performance

LOCTITE M4100 E&C

• Conductive
• screen printable
• Electroless nickel plateable

LOCTITE ABLESTIK 8700E

• Electrically conductive
• Retains high shear strength after thermal cycling
• Thermally conductive

LINQSOL EMC-7535 | Black Epoxy Mold Compound

• Green molding compound
• Designed for high-power TO packages
• High Tg, low water absorption, low modulus, and excellent thermal stability

LOCTITE ABLESTIK ABP 8068TD

• Good workability
• ±50 W/mK Thermal Conductivity
• High electrical conductivity

LINQSOL EMC-7142 | Black Epoxy Mold Compound

• Green epoxy molding compound
• Designed for SOP and QFP
• Low water absorption, low stress, and excellent moldability

LOCTITE ECCOBOND D125 F DR

• Low water absorption
• Low exotherm
• Non-sag

LOCTITE ECI 7004HR E&C

• High Resistivity
• Screen Printable
• Flexible low temperature drying cycles

LOCTITE NCI 7002 E&C

• Non-Conductive
• Screen Printable
• Flexible low temperature drying cycles

OPTOLINQ LE-5031HY | Two part epoxy resin

• Low viscosity
• High transparency
• Excellent solvent, aging, anti yellowing, and thermal resistance

OPTOLINQ LE-2161 | Two part epoxy resin

• Low viscosity
• Fast curing
• High transparency and good electrical properties

FM-4411 | Reactive PDMS - Bi terminal Hydroxy

• Bi terminal
• 1,000 g/mol | 35 mPas
• Hydroxy functional groups

LINQCELL NWM 300 | 0.3mm Nickel Wire Mesh

• 0.30 mm wire diameter
• Excellent chemical stability and anti-corrosion resistance
• High electrical conductivity

LINQCELL NWM 250 | 0.25mm Nickel Wire Mesh

• 0.25 mm wire diameter
• Excellent chemical stability and anti-corrosion resistance
• High electrical conductivity

LINQSOL EMC-7535MF | Black Epoxy Mold Compound

• Green molding compound
• Designed for high-power TO packages
• High Tg, low water absorption, low modulus, and excellent thermal stability

LINQTAPE HDT1SR | Hydrogen detection tape

• 100 um film thickness
• Visual H2 leak detection
• 3,000V Breakdown voltage

LINQPAK Foil | Thermal insulation material

• Multi-layered
• Enhanced Dry Ice Efficiency
• Size customization

LOCTITE ABLESTIK E 8502-1

• One component
• Low stress
• Thermally conductive

OPTOLINQ TMC-3282 | Transparent Mold Compound

• Exceptional moldability with long spiral flow
• Excellent performance at high temperature and high humidity conditions
• Excellent adhesion and low stress

LOCTITE ABLESTIK NCA 2286AE

• Dual Cure
• High elongation strength
• Active alignment in lens holder attach

Hysol GR350HT | Black Epoxy Mold Compound

• High Thermal Conductivity GR30
• Designed for TO92 and TO220 packages
• Excellent reliability under high temperature and bias

WS830 | Wax Conditioning Sheets

• High flow
• Excellent elastic properties
• Homogeneous waxing

LOCTITE ECI 1006 E&C

• Halogen free
• High conductivity
• Fine line screen printable

MCL-T20 | Melamine Transfer Cleaning Pellets

• Excellent Cleaning Efficiency
• Ideal for High-Precision Industries (Electronics and Automotive)
• Enhanced Mold Lifespan and Minimized Downtime

LINQCELL GFP2000 | Graphite Felt

• 2.00 mm - 2000 µm - 78 mil
• High chemical resistance, electrical conductivity, and open porosity
• Electrode materials for high-temperature batteries

OPTOLINQ TMC-3282SF | Transparent Mold Compound

• Exceptional moldability with long spiral flow
• Excellent performance at high temperature and high humidity conditions
• Excellent adhesion and low stress

OPTOLINQ LE-8011HT | Two part epoxy resin

• Excellent thermal stability
• Excellent UV stability
• High light transmittance

LINQSOL EMC-6043 | Black Epoxy Mold Compound

• High Spiral flow
• Designed for SOT and Modules
• Low stress and Low Moisture Absorption

LINQSOL EMC-9012 | Black Epoxy Mold Compound

• Green epoxy molding compound
• Designed for Ball Grid Array (BGA) and Land Grid Array (LGA) packages.
• Ultra low water absorption, low stress, and excellent reliability performance.

MM304 | Methacrylate adhesion promoter Additive

• Mild pleasant odor
• Hydrolytic resistance
• Lower weight loss on cure than IBOMA

LINQCELL GDL1000 | 1.0mm Carbon Plate

• 1.00 mm – 1000 µm – 39 mil
• High electrical conductivity and tunable compressibility
• Porous transport and gas diffusion layers for water electrolyzers and fuel cells

BMI-689M Low Viscosity Liquid Bismaleimide

• Hydrophobic
• High adhesion to various substrates
• Superior thermal stability

OPTOLINQ LE-2161HT | Two part BPA-free epoxy resin

• Low viscosity
• Non-yellowing
• High transparency and good mechanical properties

Chemlinq MRE-S101 | Silicone Mold Release Spray

• Silicone based Mold Release spray
• Green label
• Compatible with Epoxy Mold Compound

Hysol GR910-K | Black Epoxy Mold Compound

• Halogen free
• High fluidity to avoid W/S issue
• Designed for BGA/LGA

OLS-1000LV | Liquid encapsulant - Two part Epoxy

• Extremely Low viscosity
• Rapid Cure
• Visible Light Blocking

OLS-1000HV | Liquid encapsulant - Two part Epoxy

• Excellent Mechanical Properties
• Halogen Free
• Rapid Cure

MM220 | Mono-acrylate monomer

• Low Viscosity
• Low weight loss on cure
• Minimizes cure shrinkage

Benzimidazole CAS #51-17-2

• Enhanced Thermal Stability
• Versatile Chemical Base
• Corrosion Protection

OPTOLINQ OLS-5812M | Liquid encapsulant - Two part silicone

• High reliability
• Excellent thermal and light resistance
• Excellent adhesion to different materials

LINQSOL EMC-9131 | Black Epoxy Mold Compound

• High Spiral flow
• Designed for SOT and Modules
• Low stress and Low Moisture Absorption

LOCTITE ABLESTIK 2025DNP

• Excellent dispense capabilities
• For mother die in array packaging
• 260ºC reflow capability for Pb-free applications

LOCTITE ECI 1014 E&C

• Low temperature drying
• High conductivity
• Compatible for use with polycarbonate, polyester and polyurethane

LOCTITE ABLESTIK FS 849-TI

• Low outgassing
• Low electrical resistance
• High thermal conductivity - 7.8 W/mK

DCT-PET115 | Polyethylene Die Cutting Tape

• 115 µm film thickness
• Acrylic adhesive
• Specifically tailored for glass and ceramic

DCT-PO165 | Polyolefin Die Cutting Tape

• 165 µm film thickness
• UV removable acrylic adhesive
• Gentle adhesion for packaging substrates and glass

DCT-PO200 | Polyolefin Dicing Tape

• 200 µm film thickness
• UV removable acrylic adhesive
• Gentle adhesion for packaging substrates and glass

DCT-PVC95 | Polymerized Vinyl Chloride Dicing Tape

• 95 µm film thickness
• UV removable acrylic adhesive
• Strong adhesion for silicon wafer applications

DCT-PVC80NUV | Polymerized Vinyl Chloride Dicing Tape

• 80 µm film thickness
• Translucent Film
• Acrylic non UV adhesive

BGT-PO130 | Polyolefin Back Grinding Tape

• 130 µm film thickness
• UV Removable acrylic adhesive
• Back grinding compatible, general purpose

BGT-PO180 | Polyolefin Back Grinding Tape

• 180 µm film thickness
• Urethane UV removable adhesive
• High accuracy and easy to peel

WS800 | Wax Conditioning Sheets

• Excellent conditioning for green EMCs
• Fast cure time
• No lead frame and preheating required

OPTOLINQ LE-EP123 | One-Part Epoxy encapsulant

• Excellent thermal stability
• Excellent UV stability
• High light transmittance

LOCTITE ABLESTIK EMI 8890SB

• Conformal EMI shielding
• Excellent adhesion on EMC
• Spray coating

LINQCELL GDP090 | 90um Carbon Paper

• Ultra-thin thickness (0.09 mm - 90 µm - 3.54 mil)
• High graphitization temperature (2000 °C)
• Optimized as gas diffusion layers in fuel cells

LINQCELL GDP250 | 250um Carbon Paper

• 0.25 mm – 120 µm – 9.84 mil
• Customizable with PTFE Coating and Available in Roll Form
• Optimized as gas diffusion layers in fuel cells

LINQCELL GDP310 | 310um Carbon Paper

• 0.31 mm - 310 µm - 12.20 mil
• Customizable with PTFE Coating and Available in Roll Form
• Optimized as gas diffusion layers in fuel cells

LINQCELL GDP120 | 120um Carbon Paper

• 0.12 mm - 120 µm - 4.72 mil
• High graphitization temperature with enhanced hydrophobicity from MPL coating
• Optimized as gas diffusion layers in fuel cells

Hysol GR700 | Black Epoxy Mold Compound

• Low stress
• For high power devices
• Good electrical performance

LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

• Green epoxy molding compound
• Thermally conductive molding compound
• Designed for transistor outline (TO) and fullpack power packages

VRB-MEM50 | 50μm VRB membrane

• Designed as cation (proton) exchange membranes for redox flow batteries
• High acid capacity and conductivity for improved performance
• Extended service life

VRB-MEM75 | 75μm VRB membrane

• Designed as cation (proton) exchange membranes for redox flow batteries
• High acid capacity and conductivity for improved performance
• Extended service life

LINQCELL GDP280 | 280um Carbon Paper

• 0.28 mm - 280 µm - 11.0 mil
• Enhanced hydrophobicity from MPL/PTFE and Available in Roll Form
• Optimized as gas diffusion layers in fuel cells

LOCTITE ABLESTIK ABP 8068TH

• Robust reliability
• 150 W/mK Thermal Conductivity
• Low stress

LINQCELL GDP340-MP | 340 um Carbon Paper

• 0.34 mm - 340 um - 13.4 mil
• Enhanced hydrophobicity from MPL/PTFE and Available in Roll Form
• Optimized as gas diffusion layers in fuel cells

LINQSOL EMC-9023 | Epoxy Mold Underfill

• Green epoxy molding compound
• Epoxy mold undefill
• Designed for FCBGA, FCCSP, SiP

LOCTITE ABLESTIK ABP 6395T

• High reliability
• 30 W/(m-K) Thermal Conductivity
• Good adhesion to Ag, Cu, PPF, Non-BSM, and BSM die

LOCTITE ABLESTIK ATB 125GR

• Low ionic content
• Excellent adhesion on both metal lead frames and BGAs
• High modulus

LOCTITE ECCOBOND LCM 1000AG-1

• High Toughness
• Ultra Low warpage
• CTE matching Silica

LOCTITE ABLESTIK ABP 6392TEA

• High electrical conductivity
• High thermal conductivity
• Good adhesion to a variety of substrates

CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

• Low viscosity
• Dual cure mechanism
• Multifunctional

U-847 | Dimer Diisocyanate Urethane Dimethacrylate

• Low color
• Low cure shrinkage
• BPA-free

LINQSOL EMC-G135 | Thermally Conductive Epoxy Mold Compound

• Green epoxy molding compound
• Low cost thermally conductive molding compound
• Designed for rectifier bridges and SMX packages

PET1S-UT-Clear | 1-mil Clear Polyester (PET) Tape with ultra thin Silicone Adhesive

• 1 mil thick polyester film
• Ultra thin silicone adhesive
• 4200V breakdown voltage

LOCTITE ABLESTIK ABP 8068TI

• High thermal and electrical properties
• Low sintering temperature
• High reliability

LOCTITE ABLESTIK NCA 2280

• Non-conductive
• Fast cure at low temperature
• High thixotropic index

LOCTITE ABLESTIK NCA 2390

• High dispense aspect ratio
• Fast cure at low temperature
• High thixotropic index

LINQCELL CAT-NiAl

• Low overpotential for hydrogen evolution reaction
• Platinum-group metal (PGM)-free catalyst
• Optimized as cathode for alkaline water electrolyzers

LINQCELL ANO-NiAl

• Low overpotential for oxygen evolution reaction
• Platinum-group metal (PGM)-free catalyst
• Optimized as anode for alkaline water electrolyzers

LINQCELL ALK-PCS500

• Low internal resistance
• High gas barrier properties
• Optimized separator for large-scale and high-pressure alkaline water electrolyzers

LOCTITE D125 F

• Low exotherm
• High speed dispensing
• Low cure temperature

LINQSOL EMC-1533 | Black Epoxy Molding Compound

• Green molding compound
• Designed for transistor outline (TO) and double decawatt (D2PAK) packages
• Excellent workability, low water absorption, low modulus, and excellent thermal stability

LINQSOL EMC-9012H | Black Epoxy Mold Compound

• Green epoxy molding compound
• Designed for Ball Grid Array (BGA) packages and Quad Flat No Leads (QFN) Packages
• High glass transition temperature, low stress, and excellent reliability performance

LINQSOL EMC-G833 | Black Epoxy Mold Compound

• Green epoxy molding compound
• Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
• Excellent reliability performance

LINQSOL EMC-G833R | Black Epoxy Mold Compound

• Green epoxy molding compound
• Designed for Quad Flat No Leads(QFN) and Quad Flat (QFP) packages
• Excellent reliability performance (MSL 1)

LPK-SZBICE | Blue Ice Spongepack

• Shape-Retaining Design
• Long-Lasting Cooling (0ºC to 8ºC) for several days
• Reusable & Durable

LOCTITE ABLESTIK 968-4

• Electrically Insulating
• B-Stageable
• Screen printable

LINQCELL VRB-AEM50

• 50um - Low ohmic resistance
• Excellent oxidative stability and chlorine resistance
• Designed as ion exchange membranes for redox flow batteries

LINQCELL VRB-AEM30

• 30um - Ultra low ohmic resistance
• Excellent oxidative stability and chlorine resistance
• Designed as ion exchange membranes for redox flow batteries

LINQCELL CAT-NiMoAl

• Low overpotential for hydrogen evolution reaction
• Platinum-group metal (PGM)-free catalyst
• Optimized as cathode for alkaline water electrolyzers

OPTOLINQ TMC-2100H | Transparent Mold Compound

• Optimal spiral flow
• Low moisture absorption
• Superior moldability and reliability

OPTOLINQ TMC-2100IR | Transparent Molding Compound

• Low moisture absorption
• Superior moldability and reliability
• For IR Applications

Hysol GR910-LB| Black Epoxy Mold Compound

• Halogen free
• High fluidity to avoid W/S issue
• Designed for BGA/LGA

RCS 550 | Rubber Cleaning Sheets

• Low torque, suitable for intricate cavities and air vents
• No mold abrasion & corrosion
• Minimal odor

RCS 560 | Rubber Cleaning Sheets

• High torque, high cleaning efficiency for deep residues
• No mold abrasion & corrosion
• Minimal odor

TMC-G373H | Transparent Epoxy Molding Compound

• Exceptional moldability with waxed formulation
• Low moisture absorption even at high temperature and high humidity conditions
• Excellent solder resistance for reliability

EMC-G274 | Epoxy Molding Compound for Photocouplers

• Good moldability
• Designed for photocoupler / optocoupler devices
• Excellent mechanical integrity

EMC-G208 | Epoxy Molding Compound

• High Tg
• Good moldability
• Low stress & water absorption

WMC-G279 | White Epoxy Molding Compound

• White transmitting EMC for optocouplers
• Balanced moldability and cycle efficiency
• Low stress

EMC-G845 | Black Epoxy Molding Compound

• Green epoxy molding compound
• Designed for QFN & QFP packages
• Satisfies JEDEC MSL 3 reliability

EMC-G836 | Epoxy Molding Compound

• For QFN & QFP packages
• Meets JEDEC MSL 3 reliability requirements
• High spiral flow

LOCTITE ABLESTIK 958-7 | Electrically Conductive Adhesive

• Electrically conductive
• Good adhesion to gold
• Heat cure

MCL-T33 | Melamine Transfer Cleaning Tablet

• Transfer grade
• Designed for semiconductor molds
• High adhesive strength

EMC-G194 | Black Epoxy Molding Compound

• Good moldability
• Low stress
• High adhesion

LOCTITE 3296 | UV-curable Epoxy Adhesive

• Fast UV cure
• High Tg and low CTE
• Low shrinkage during & after cure

Sn10Pb90 on 13" Tape & Reel

• Sn10Pb90 alloy on tape & reel
• Suitable for BGA and flip chip packaging techniques
• Compatible with almost all existing pick and place feeders

TFP1200 | 1200um Titanium Fiber Paper

• 1.20mm - 1200um - 47.2mil
• 50 - 60% Porosity
• Electrode and Support structure

TPP500 | 500um Sintered Titanium Powder

• 0.50mm - 500um - 20mil
• 30–40% Porosity
• Gas Diffusion and Porous Transport Layer for PEM Water Electrolyzers and Fuel Cells

LE-8011U | UV-Resistant Clear Epoxy Resin

• High thermal stability with a Tg> 160°C
• Strong resistance to UV degradation
• High light transmittance

OPTOLINQ TMC-688H | Transparent Mold Compound

• Low Lumen Decay
• High Glass Transition Temperature
• Superior moldability and reliability

LOCTITE ABP 2100ANP | PFAS-Free Die Attach Adhesive

• Formulated for Pb-free applications
• High hot/wet adhesion
• Excellent dispensability

MCL-T27 | Melamine Transfer Cleaning Pellets

• Enhanced workability
• Surface restoration
• Operational efficiency

WMC-G261 | White Epoxy Molding Compound for Optocouplers

• Excellent reflectance
• Ideal spiral flow
• Superior moldability and reliability

BMC-G241 | Black Optocoupler Epoxy Molding Compound

• Good reflectance
• Heat-resistant
• Ideal spiral flow

GR900 | QFN Epoxy Molding Compound

• Low stress and moisture absorption
• High adhesion
• Low moisture absorption

LOCTITE 3626M | Surface Mount Adhesive

• Heat-cured
• For SMD components to PCB
• Compatible with syringe and stencil print

LOCTITE ABLESTIK ABP 2053SNP

• Formulated without intentionally added PFAS
• One-component
• Low stress

PI-6324-001 | Insulating Polyimide Ink

• Thermal Curable
• Heat Resistance
• Low Temperature Curing

LINQSOL EMC-G375 | Thermally Conductive Mold Compound

• Thermally conductive molding compound
• Designed for fullpack TO power packages and bridge rectifier packages
• Excellent mechanical integrity

OPTOLINQ TMC-688L | Transparent Mold Compound

• Low lumen decay
• Superior moldability and reliability
• For low stress molding applications

LINQSOL EMC-G374

• Ultra-high glass transition temperature (272 °C)
• Designed for high-power SiC and GaN devices
• High degradation temperature, and excellent thermal stability

ALPHA NF3000 Water-Soluble Flux

• Water-soluble formulation
• Organic activating system
• Wide thermal window

ALPHA SC-7525 Cleaner

• IPA alternative
• High solvency
• Suitable for manual & immersive methods

KESTER 5744 Solder Saver

• Effectively removes dross
• Low-fuming and remains stable at soldering temperatures.
• Can be easily skimmed off the pot after use.

KESTER 186 Soldering Flux

• Approved under MIL-F-14256 as Rosin Mildly Activated.
• High thermal stability
• Excellent electrical reliability

KESTER 951 Soldering Flux

• Zero-halogen, non-rosin formula
• High Surface Insulation Resistance (SIR)
• Minimizes defects

KESTER 977 Soldering Flux

• Biodegradable at pH ≥ 2.0
• Compatible with most solder masks and laminates
• Does not degrade SIR

KESTER 979 Solder Flux

• Chemically compatible with most solder mask & laminates
• Does not degrade SIR
• Bellcore GR-78 Compliant

KESTER NF372-TB Soldering Flux

• Provides good solderability at atmospheric temperature
• Zero-halogen & low solids formulation
• Safe for rework

KESTER 985M Soldering Flux

• Low-solid & halide-free
• No-clean flux
• Improves soldering performance

KESTER 5252M Cleaner

• Quickly air dries
• Halogen-free formulation
• Non-ionic

KESTER 959T Soldering Flux

• Excellent wetting
• Low rosin content
• Non-corrosive

KESTER 2331-ZX Soldering Flux

• Neutral pH
• Minimal foaming
• Low-odor emission

KESTER RF771 Rework Flux

• High thermal stability
• Leaves bright & shiny solder joints post-reflow
• Classified as ORM0 per J-STD-004

KESTER 186 Flux-Pen

• High thermal stability
• Improves soldering performance
• ROL1 per J-STD-004 & J-STD-004B

KESTER 951 Flux-Pen

• Improves soldering performance
• Non-corrosive tack-free residue
• ORL0 per J-STD-004

KESTER 952-D6 Flux-Pen

• Residues almost colorless
• Improves soldering performance
• Reduced odor

KESTER 2331-ZX Flux-Pen

• High activity
• Chemically compatible with most masks and laminates
• Neutral pH chemistry

KESTER TSF-6852 Tacky Soldering Flux

• 8-hour stencil life
• Leaves bright and shiny joints
• ORH1 per J-STD-004

KESTER TSF-6522RH Tacky Soldering Flux

• High tack value
• Long tack life
• Can reflow in air or nitrogen

KESTER 952-S Soldering Flux

• Formulated for photovoltaic applications
• High reliability ribbons
• Halogen-free & low-solids

KESTER 2235 Soldering Flux

• Minimizes icicling and bridging
• Compatible with most masks and laminates
• High activity

ABchimie DVS Silicone Thinner

• Specially formulated for silicone conformal coatings
• Supports spray and dip application
• Maintains viscosity in open-tank dip systems

HGP12 | High Thermal Conductivity Gap Pad

• 0.13 Thermal Impedance
• 12 Thermal Conductivity
• Low oil bleeding & Low volatile

HGP12PT | High Thermal Conductivity Putty Pad

• 0.13 Thermal Impedance
• 12 Thermal Conductivity
• Low oil bleeding & Low volatile

ABchimie LDM High-Temperature Solder Mask

• Dries at room temperature
• Withstands temperatures up to 270°C
• Can be completely removed by hand

ABchimie DVU Urethane Thinner

• Formulated for urethane‑based conformal coatings
• For dip coating and spray coating applications
• Consistent, stable solvent composition

ABchimie R12230 Optically Clear Encapsulation Gel

• Optically clear
• Quick setting
• Good heat stability

ABchimie DVP Permanent Coating Stripper

• Designed for controlled application
• Strong solvency
• Easy to apply and remove

ABchimie APS AC31 Acrylic Thinner

• Formulated for acrylic conformal coatings
• Provides stable evaporation behavior
• Enables viscosity control

Humiseal Thinner 521EU

• RoHS Directive 2002/95/EC compliant
• For use with HumiSeal conformal coatings
• Ensures proper viscosity adjustment

ABchimie DVA BA Non-Toxic Acrylic Thinner

• Non‑toxic solvent blend
• For AVR80 BA acrylic coating
• Easy to mix

ABchimie DVA XY Acrylic Thinner

• Designed for acrylic conformal coatings
• Optimized for AVR80 XY
• Ensures proper viscosity for dip, spray, and automated coating processes

Kester TSF-ULR18

• Ultra-low residue
• No-clean formulation
• High reliability

Kester TSF-6502JCR

• 8-hour stencil life
• Printing up to <16mil pitch
• ROL1 & Bellcore GR-78 compliant

KESTER 5252 Cleaner

• Quickly air dries
• Halogen-free formulation
• Non-ionic

KESTER 182 Soldering Flux

• High-purity composition
• Meets IPC J-STD-002 and J-STD-003 requirements
• Excellent electrical reliability

KESTER 958 Soldering Flux

• Excellent for bare copper applications
• Conformal coating compatible
• Improves soldering performace

KESTER 2166-BN Soldering Flux

• Halide-free formulation
• Superior surface insulation resistance
• Easy residue removal

HumiSeal Thinner 64

• RoHS Directive 2015/863/EU compliant
• Ensures proper viscosity adjustment
• For use with HumiSeal 2A64

HumiSeal Thinner 73

• RoHS Directive 2015/863/EU compliant
• Ensures proper viscosity adjustment
• For use with 1B73 and 1A20

HumiSeal Thinner 503

• RoHS Directive 2015/863/EU compliant
• Ensures proper viscosity adjustment
• Compatible with HumiSeal 1B12, 1B31, 1B66, and 1B73

HumiSeal Thinner 505

• RoHS Directive 2015/863/EU compliant
• Ensures proper viscosity adjustment
• Compatible with HumiSeal 1R32 and 1R32A-2

HumiSeal Thinner 521

• RoHS Directive 2015/863/EU compliant
• Ensures proper viscosity adjustment
• Compatible with multiple HumiSeal conformal coatings

HumiSeal Thinner 600

• RoHS Directive 2011/65/EC compliant
• Compatible with multiple HumiSeal conformal coatings
• Specialty thinner

HumiSeal Thinner 602-245

• RoHS Directive 2011/65/EU compliant
• For acrylic conformal coatings
• Ensures proper viscosity adjustment

HumiSeal Thinner 604

• RoHS Directive 2011/65/EC compliant
• Specialty thinner
• For use with 1B31EPA and 1B73EPA

HumiSeal Thinner 673

• RoHS Directive 2015/863/EU compliant
• For use with acrylic conformal coatings
• Ensures proper viscosity adjustment

HumiSeal Thinner 701

• RoHS Directive 2011/65/EC compliant
• For use with multiple HumiSeal conformal coatings
• Ensures proper viscosity adjustment

HumiSeal Thinner 789

• For use with LTX series of conformal coatings
• Low odor
• No aromatic compounds

HumiSeal Thinner 901

• Low toxicity
• BTX-free
• Compatible with multiple coatings

HumiSeal Thinner 903

• Slower evaporation rate
• Smoother flow
• Better leveling

HumiSeal Thinner 904

• Faster evaporation rate
• Smoother flow
• Faster drying time

HumiSeal Thinner 905

• For rapid cure applications
• Fast evaporation rate
• For faster recoat process

HumiSeal Thinner 999

• Optimized viscosity control
• RoHS compliant
• High-purity solvent blend

HumiSeal Thinner 535

• RoHS Directive 2015/863/EU compliant
• Ensures proper viscosity adjustment
• Compatible with 2A53 conformal coating

HumiSeal Stripper 1063

• Non-Acidic Polyurethane Removal
• Controlled One-Hour Soak
• Clear Low-Density Stripper

DOWFROST LC 25 Heat Transfer Liquid

• Made with Dow PURAGUARD™ USP/EP grade PG (>99.8% purity)
• Freeze protection to –10°C (14°F)
• Formulated for high-efficiency heat transfer

ALPHA EF-8800HF No Clean Flux

• Robust soldering performance
• Evenly spread, tack free residue
• Halide-free

ALPHA SM-110 Solvent Cleaner

• High solvency
• High flux loading capacity
• Non-corrosive

LORD 7545 Two-Component Urethane Adhesive System

• 1:1 mix ratio, 100% solids urethane adhesive
• 1.5 to 65 minute selectable working time
• Non-sag structural bonding with environmental and solvent resistance.

DOWSIL™ 1-2577 Conformal Coating

• One-part silicone conformal coating
• UV indicator for inspection and quality control
• High dielectric strength and electrical insulation

DOWSIL™ 3145 RTV Mil-A-46146 Adhesive/Sealant

• Military-grade
• High strength
• Non-flowing paste

DOWSIL™ 7091 Adhesive Sealant

• Non-sag rheology
• One-part moisture cure
• Stable and flexible from -40 to 180℃

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

• Low viscosity for flow into small gaps and complex PCB assembly spaces
• Soft, low-stress encapsulation during thermal cycling
• UL 94 V-0 and UL RTI rated at 150°C

DOWSIL™ TC-2035 CV Thermally Conductive Adhesive

• 3.3 W/m·K thermal conductivity
• Ultra-thin bondline thickness
• Low volatile content

Frekote 700-NC

• No Chlorinated Solvents
• High Gloss Finish
• No Contaminating Transfer

ALPHA PoP707 Lead-Free No-Clean Solder Paste

• Fine particle dispersion (<10 µm)
• ROL0 per IPC J‑STD‑004
• Outstanding SIR performance

ALPHA OM-338-PT Paste Solder Flux

• Consistent printing down to 11 mil (0.28 mm)
• Halide‑free (ROL0)
• Meets IPC‑7095 Class 3 voiding

PERMABOND® MH052 Anaerobic Thread Sealant

• BAM and DVGW approved anaerobic thread sealant for oxygen, natural gas, and LPG systems
• Leak-tight sealing performance up to the burst pressure rating of the pipe
• Particle-free anaerobic formulation resists shrinkage, cracking, and shredding unlike pipe dope and PTFE tape

3M™ Scotch-Weld™ DP6310NS

• 1:1 mix ratio by volume
• Non-sag rheology
• 9-minute work life

3M™ Fastbond™ 2000NF

• Quick bonding without heat
• Immediate handling strength.
• Post-formable and heat resistant

3M™ Scotch-Weld™ Structural Polyurethane Adhesive DP609

• Rapid room-temperature curing
• Flexible structural bonding
• Approx. 9-minute work life at 23°C

3M™ Scotch-Weld™ Urethane Adhesive DP6330NS

• 1:1 mix ratio
• 15-minute work life
• Non-sag rheology

3M™ Scotch-Weld™ Low Odor Acrylic Adhesive DP8010

• Ability to structurally bond polyolefins without special surface preparation
• Excellent water and humidity resistance
• One step process

3M™ Foam Fast Spray Adhesive 74

• Used for bonding flexible urethane or latex foam
• Provides excellent coverage.
• Soft, non-dimpling glue lines.

3M™ Repositionable Spray Adhesive 75

• Provides "tape-like" bonds
• Bonds paper, cardboard, acetate, foil, fabrics, etc.
• Extra-long tack range

3M™ Super 77™ Universal Spray Adhesive

• High tack
• High coverage
• Fast drying

3M™ Hi-Strength 90 Spray Adhesive

• High strength
• Contact-type adhesive
• Fast-drying

3M™ Citrus-Based Industrial Cleaner

• No chlorinated or petroleum-based solvents
• Gentle cleaning
• Fresh citrus scent

3M™ Double Sided Tape 9191

• Rubber Pressure Sensitive Adhesive
• Double Sided Tape
• High - Tack

3M™ Transfer Tape 465

• Acrylic Adhesive
• Excellent adhesion to paper stocks
• Kraft Release Liner

3M™ Double Sided Tape 415

• Double Sided Acrylic Adhesive
• Good adhesion to various substrates
• Excellent for indoor / outdoor applications

Scotch® ATG Transfer Tape 904

• Adhesive Transfer Tape
• No Carrier Film
• Clean and instant bonding

Scotch® ATG Transfer Tape 924

• Thin 0.002 in. (0.05 mm) profile for low-profile bonding
• Reverse wound construction for use with ATG hand-held dispensers
• Provides consistent and controlled adhesive application

Scotch® ATG Transfer Tape 926

• Provides immediate and permanent bonds with high adhesion
• Excellent performance up to 450 ºF (232 ºC)
• Adheres to a variety of substrates (ABS, acrylic, PP, PE, etc.)

Scotch® ATG Transfer Tape 969

• Provides immediate and permanent bond
• Designed to adhere to a variety of substrates
• Conforms easily to curves and contours

3M™ Double-Sided Paper Tape 9086

• Bonds to a wide variety of substrates
• 0.5 mil tissue carrier
• Double coated with 3.5 mil adhesive on each side

3M™ Transfer Tape 9485PC

• Utilizes a fiber-reinforced adhesive for roll stability
• Resistance to humidity, water, solvent, and chemicals
• The 5 mil (127µm) thick version of 3M™ Adhesive Transfer Tape 9482PC

3M™ Removable and Repositionable Double-Sided Tape 9415PC

• Features a removable, repositionable, low-tack adhesive
• Withstands temperatures as low as -20 °F (-29 °C) and as high as 158 °F (70 °C)
• Ideal for temporary mounting of lightweight materials

3M™ VHB™ Transfer Tape F9473PC

• Transparent, double sided, 10 mil (0.26 mm) VHB™ transfer tape
• Short term temperature tolerance of up to 500 °F (260 °C)
• Operating temperature tolerance of up to 300°F (149°C)

3M™ VHB™ Tape 4910F

• Clear Double Sided Tape
• Acrylic Adhesive
• Permanent Bonding for High Surface Energy Substrates

3M™ VHB™ Tape 4912F

3M™ VHB™ Tape 4991F

• High-strength bonding
• Conformable foam core
• Multi-purpose adhesive

3M™ Double Sided Urethane Foam Tape 4026

• Provides strong holding power for long-term performance
• Maintains bond integrity under elevated temperatures
• Adapts to uneven or irregular surfaces

3M™ Double Sided Urethane Foam Tape 4032

• Provides durable, long-term holding power
• Flexible and conformable for bonding on irregular surfaces
• Foam structure reduces vibration and enhances stability

3M™ Double Sided Foam Tape 9528

• Rubber adhesive delivers quick “grab” for fast bonding
• Adhesive on both sides for easy mounting and joining
• Provides light conformability and consistent thickness

3M™ VHB™ Tape GPH-110GF

• High Temperature Performance (Up to 230°C)
• Permanent seal against water, moisture, etc.
• 1.1 mm thickness

3M™ VHB™ Tape GPH-160GF

• High Temperature Performance (Up to 230°C)
• 1.6 mm thickness
• Permanent seal against water, moisture, etc.

3M™ VHB™ Tape GPH-060GF

• High Temperature Performance (Up to 230°C)
• 0.6 mm thickness
• Permanent seal against water, moisture, etc.

3M™ VHB™ Tape 5925F

• Double sided acrylic foam tape
• 0.6 mm thickness
• Excellent adhesion to multiple substrates

3M™ VHB™ Tape 5962F

• Double sided acrylic foam tape
• 1.6 mm thickness
• Bonding to multiple substrates

3M™ Dual Lock™ Resealable Snap Tape SJ3540

• Black, interlocking mushroom-shaped heads (250 stem density per square inch)
• Mates with Type 170, Type 250 or Type 400 stem densities
• Strong fastener secures with an audible snap, verifying closure

3M™ Dual Lock™ Reclosable Snap Tape SJ3550CF

• Black, interlocking mushroom-shaped heads (250 stem density per square inch)
• Mates with Type 170, Type 250 or Type 400 stem densities
• Clear, acrylic, tape bonds well to a variety of substrates

3M™ Dual Lock™ Resealable Snap Tape SJ3560

• Clear, interlocking mushroom-shaped heads (250 stem density per square inch)
• Mates with Type 170, Type 250 or Type 400 stem densities
• Clear, acrylic, tape bonds well to a variety of substrates

3M™ Dual Lock™ Resealable Click Strap SJ3870

• Black, interlocking mushroom-shaped heads (250 stem density per square inch)
• Mates with Type 170, Type 250 or Type 400 stem densities
• Black, modified acrylic

3M™ Dual Lock™ Resealable Snap Tape SJ3540D

• Black, interlocking mushroom-shaped heads (250 stem density per square inch)
• Mates with Type 170, Type 250 or Type 400 stem densities
• Features good temperature resistance of 120°F (49°C)

3M™ Dual Lock™ Resealable Snap Tape SJ3551CF

• Black, interlocking mushroom-shaped heads (400 stem density per square inch)
• Mates with Type 170 and Type 250 stem densities
• Strong fastener secures with an audible snap

3M™ Dual Lock™ Resealable Snap Tape SJ387B

• Black, interlocking mushroom-shaped heads (250 stem density per square inch)
• Mates with Type 170, Type 250 or Type 400 stem densities
• Strong fastener secures with an audible snap, verifying closure

3M™ Resealable Loop and Hook Fastener SJ352D

• Provide a firm adhesive bond to a wide variety of surfaces
• Durable for thousands of closures
• Best suited for indoor use

Scotch® ATG Transfer Tape Gun ATG700

• Automatic liner rewind minimizes waste and eliminates cleanup
• One-handed, trigger-controlled operation supports fast and consistent application
• Delivers uniform adhesive thickness without oozing, glue lines, or overspray

3M™ Scotchcast™ 260 Epoxy Powder Resin

• Fast curing
• Excellent electrical properties
• Excellent flow • UL 1446 Electrical Insulation System (EIS) approval at class 120(E), 130(B), 155(F), and 180(H)

3M Electrically Conductive Double-Sided Tape 9793KW Series

• 0.02-0.20 ohm under 3M ETM-12 test conditions
• Typical expected shielding effectiveness of 40-60 dB
• Broad thickness and adhesion selection

3M Electrically Conductive Double-Sided Tape 9793KT Series

• Typical Z-axis electrical resistance`
• Typical expected shielding effectiveness is 40-60 dB
• Ten thicknesses from 130 to 500 µm

3M EMI Absorber & Magnetic Shielding Material AB3000 Series

• Broadband 1-10 GHz EMI Absorption
• Configurable Thickness & Adhesive Options
• Die-Cuttable Sheet Format

SIKAFLEX 232US

• High-Green-Strength Assembly Bonding
• Non-Sag Gap-Filling Application
• One-Part Moisture-Cure Processing

3M 425 ALUMINUM FOIL TAPE

• Aluminum Backing with Acrylic Adhesive
• Great for Sealing
• Low Moisture Vapor Permeability

3M™ Scotch-Weld™ Structural Adhesive Film AF 30

• Thermosetting Structural Adhesive Film
• 5, 10, and 12 mil Thicknesses
• Flexible Extremely-Low-Flow Film

3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2U

• High-Strength Structural Bonding
• High- and Moderate-Tack Film Options
• 60-Minute 250 deg F Cure

Loctite 495

• One-Part Adhesive Form
• Multi-Substrate Assembly Fixturing
• Low-Viscosity Adhesive Application

Loctite 580 Pipe Sealant

• One-Component Sealing System
• Low Pressure Sealing for Inactive Metals
• Room-Temperature Sealing Cure

Loctite Ablestik 83C Conductive Epoxy Adhesive

• Silver-Filled Epoxy Adhesive
• 0.0004 ohm-cm Volume Resistivity
• Electrical-Connection Epoxy Bonding

Loctite Ablestik 2116 Non-Conductive Adhesive

• Metal/Glass/Ceramic/Plastic Staking and Bonding
• 30-Minute Pot Life
• 415 V/mil Dielectric Strength

BONDERITE C-AK 6849 AERO

BONDERITE C-AK ALUM ETCH 2 AERO

• Cleaning and Etching
• Uniform Surface Wetting
• Aluminum Surface Treatment

BONDERITE C-AK ALUM ETCH 3 AERO

• Surface Soil Removal
• Aluminum Surface Etching
• 0.05 to 0.10 mil/min Etch Rate

BONDERITE C-IC DEOXIDOZER

• Aluminum Deoxidizing, Desmutting, Etching
• Prepares for Chromating
• 1 to 10 Minute Application Rate

Loctite Ablestik CT 5047-2

• Electrically Conductive Bonding
• Room Temperature Curing
• Electrical Connections Bonding

DOWSIL 3-4154 Dielectric Gel Kit

• Electrically Insulating Material
• 550 mPa s Mixed Viscosity
• 180-Minute 80 deg C Cure

MOLYKOTE 3451 Chemical Resistant Bearing Grease

• Fluorosilicone Grease Formulation
• 40 to 450 deg F Service Range
• 340 kg Four-Ball Weld Load

DOWSIL 550 SILICONE FLUID

• Silicone Fluid Formulation
• High-Temperature Silicone-Fluid Stability
• Low-Volatility Silicone Fluid

MOLYKOTE 7 RELEASE COMPOUND

• 40 to 204 deg C Service Range
• Release, Lubrication, Sealing, and Protection
• 0.8% Evaporation at 200 deg C

DOWSIL 93-104 Ablative Material Kit

• Protects surfaces from direct flame and extreme heat exposure
• Forms a tough char with less than 0.1 mm/s penetration
• Supports brush, roll, trowel, or molded application methods

MOLYKOTE D-321R AN-FR

• Room-Temperature Application Cure
• Dry Film Lubricant Formulation
• 180 to 450 deg C Service Range

MOLYKOTE EM-D110 GREASE

• Compatible with Most Plastics
• High-Viscosity PAO Oil
• Silicone-Free Lubrication Formulation

MOLYKOTE G-2008 Synthetic Tool Gear Grease

• Fully Synthetic PAO-Based Grease with Lithium Thickener
• Manual or Automated Dispensing
• Sub-0.55 mm Four-Ball Wear

MOLYKOTE G-68 Plastic Gear Grease

• Good Compatibility with Most Plastics
• 0.014 Coefficient of Friction
• Water-Resistant Grease Lubrication

MOLYKOTE G-N METAL ASSEMBLY PASTE

• Heavy-Duty Assembly Paste
• 0.08 Coefficient of Friction
• Metal Interfaces Protection

MOLYKOTE HI-VAC SILICONE BASED HIGH VACUUM GREASE

• Low-Volatility Silicone Grease
• Less Than 0.5% Bleed
• Seals and Lubricates Vacuum and Pressure Systems

LAIRD ECCOSHIELD VY

• Non-Hardening Conductive RF-Seam Compound
• 0.001 ohm-cm Volume Resistivity
• 40 to 288 deg C Service Range

ITW PLEXUS MA422

• 10:1 Controlled Mixing
• 17 to 20-Minute Working Window
• 0.75 to 9.5 mm Gap Range

ITW PLEXUS MA832

• 10:1 Controlled Mixing
• 12 to 14-Minute Working Window
• Glass-Bead Bondline Control

DowSil 3-6077 RTV Silicone Ablative

• 0.035 mm/s Ablation Penetration Rate
• 2 to 3-Hour Working Window
• Spray or Trowel Application

BONDRITE C-AK MIL-ETCH

• Fine Satin or Frosted Etch on Aluminum
• Low-Foam Alkaline Formulation
• Scale- and Sludge-Reducing Sequestering Chemistry

COOLTHERM EP 6972 KIT

• <0.0005 ohm-cm Volume Resistivity
• 2.13 W/(m K) Thermal Conductivity
• 1:1 Weight Mixing

FREKOTE 44NC

• Multi-Cycle Mold Release
• Reduced Mold-Surface Contamination Risk
• Non-Silicone Downstream-Compatible Formulation

FREKOTE RC-321

• Consistent Multi-Cycle Mold Release
• Reduced Resin Adhesion to Mold Surfaces
• Semi-Permanent Low-Residue Coating

ALPHA HITECH CU11-3127

• One-Component Capillary Underfill
• 177 deg C Glass Transition
• 20-Minute 140 deg C Cure

Dow XIAMETER PMX 200

• 1,000 cSt Polydimethylsiloxane Fluid
• Surface Tension of 21.2 dynes/cm
• Dielectric Strength of 400 volts/mil

PS 870® Class B Corrosion Inhibitive Sealant

• Corrosion-Resistant Joint Sealing
• Long-Term Harsh-Environment Durability
• Multi-Substrate Aerospace Sealing

Loctite FREKOTE R-110

• Multi-Cycle Mold Release
• Reduced Resin Adhesion to Molds
• Semi-Permanent Low-Residue Coating

ALPHA LONCO RF-800 FLUX

• Highly Active Low-Solids No-Clean Flux
• Low Non-Tacky Residue
• IPC J-STD-004 ROL0 Classification

KESTER TSF-8808

• DI-Water-Cleanable Post-Reflow Residues
• Multi-Alloy Air-or-Nitrogen Reflow
• ORH0 Low-Volatility Soldering Flux

PERMABOND 105

• 5 to 20-Second Fixture Time
• Low-Viscosity Single-Component Adhesive
• Hard-to-Bond Plastic and Rubber Bonding

PERMABOND 2011

• Thixotropic Application Control
• 5 to 10-Second Fixturing Time
• One-Part Moisture-Cure Adhesive

LAIRD TPUTTY 607

• 6.4 W/(m K) Thermal Interface
• No-Mix Thermal Interface Processing
• Automation-Oriented Dispensing and Vertical Stability

Teroson AL 6302 Heat Curing Sealant

3M 1099

• Medium-Viscosity Application Control
• Long-Term Durability by Resisting Weathering
• Adhesion-Promoting Surface Treatment

3M 1357

• High Initial Contact Strength
• High Heat Resistance
• Up to 30-Minute Bonding Window

3M 30NF

• Water-Dispersed Contact Adhesive
• Heat-Resistant Laminate Bonding
• Greenguard-Certified Wood and Laminate Bonding

3M 427

• Dead-Soft Aluminum Foil Backing
• Moisture-Barrier Tape Applications
• -54 to 149 deg C Temperature Resistance

3M 467 MP

• 0.06 mm Thin Adhesive Construction
• Peel and Shear on High-Energy Surfaces
• Up to 204 deg C Short-Term Exposure

3M 4926

• Conformable 0.4 mm Acrylic Foam
• Multi-Purpose Acrylic Adhesive
• 620 Kpa Overlap Shear Strength

3M 550FC

• One-Component Fast Moisture Cure
• High Tensile Strength and Modulus
• Water and Salt-Spray Resistance

3M 76

• High-Tack Industrial Formulation Excels in One-Surface Bonding
• Polyethylene and Polypropylene Bonding
• Controlled Variable Lace Spray Pattern

3M 8417

• Transparent Self-Wound Polyester Film
• Edge-Tear-Resistant Film Backing
• -40 to 93 deg C Exposure Range

3M 853

• 0.06 mm Thin Tape Construction
• Solvent-Resistant Tape Adhesive
• Transparent Label-Protection Tape

3M 950

• 5 mil Adhesive 300 Construction
• High Initial Adhesion and Holding
• Multi-Substrate Pressure-Sensitive Bonding

3M 966

• Up to 232 deg C Short-Term Exposure
• 10,000-Minute Static Shear
• Metal and High-Energy-Plastic Bonding

3M CA40H

• Higher-Viscosity Controlled Dispensing
• EPDM, Vinyl, and Aluminum Bonding
• Alignment-Friendly Slower Set Time

3M DP604NS

• 4-Minute Open Time
• 1:1 Meter-Mix Processing
• 51 to 121 deg C Service Range

3M DP620NS

• 20-Minute Open Time
• 1:1 Meter-Mix Processing
• 19.9 MPa Aluminum Lap Shear

3M DP640

• 40-Minute Working Window
• Thixotropic Non-Sag Placement
• 2,160 lb/in^2 Aluminum Overlap Shear

LOCTITE ABLESTIK 104

• Up to 230 deg C Service
• Long Working Time
• High Tensile Lap Shear Strength

LOCTITE ABLESTIK 16-1

• Electrically conductive
• Room temperature or heat cure
• Good adhesion

LOCTITE ABLESTIK 2101

• 23 N/mm^2 Aluminum Lap Shear
• High-Resistivity Electrical Insulation
• Fuel, Oil, and Acid Resistance

LOCTITE ABLESTIK 2106T

• Shore D 72 within 60 Minutes
• 410 V/mil Dielectric Strength
• Metal-to-Masonry Multi-Substrate Bonding

LOCTITE ABLESTIK 2112

• Critical Electronics/Aerospace Bonding
• Non-Sag PCB Component Staking
• Electrical Insulation and Environmental Resistance

LOCTITE ABLESTIK 2113

• Low-Viscosity Optical Bonding
• Fine-Detail Flow and Wetting
• Electrically Insulating Cured Adhesive

LOCTITE ABLESTIK 2114

• Optically Clear Bonding
• 50 N/mm^2 Cured Tensile Strength
• Broad Metal/Glass/Ceramic/Plastic Compatibility

ABLESTIK 2115

• Shock- and Temperature-Cycling Resistance
• Low-Viscosity Precision Optic Bonding
• 60-Watt Laser-Energy Resistance

ABLESTIK 2135D

• Tough, Durable Epoxy for Bonding, Laminating, Sealing
• 1,200 mPa s Mixed Viscosity
• 2.7 x 10^13 ohm-cm Volume Resistivity

ABLESTIK 2143D

• Medium-Viscosity Application Control
• 1 x 10^14 ohm-cm Volume Resistivity
• Room-Temperature Adhesive Cure

ABLESTIK 2156

• 0.84 W/(m K) Thermal Conductivity
• Heat-Sensitive Component Staking
• -70 to 100 deg C Operating Range

ABLESTIK 2158

• Electrically Insulating Staking Epoxy
• Flexible Mismatched-Adherend Bonding
• 2 x 10^15 ohm-cm Volume Resistivity

ABLESTIK 2248

• Thixotropic Application Control
• 14.8 kV/mm Dielectric Strength
• 1-Hour Working Window

ABLESTIK 2332-17U

• Solvent-Free Bonding Formulation
• 90-Minute 100 deg C Cure
• 24 N/mm^2 Aluminum Lap Shear

ABLESTIK 24

• Water-Clear Thin-Bondline Adhesive
• 30-Minute Pot Life
• Flexible Cured Adhesive

ABLESTIK 286

• 1.04 W/(m K) Thermal Interface
• 30-Minute Working Window
• Room-Temperature Thermal Interface Cure

ABLESTIK 2907

• Electrically Conductive Bonding
• Room-Temperature Adhesive Cure
• Glass-to-Plastic Epoxy Bonding

ABLESTIK 293-1

• Difficult-Substrate General Assembly Bonding
• 37.9 N/mm^2 Aluminum Lap Shear
• 3.20 x 10^14 ohm-cm Volume Resistivity

ABLESTIK 293-21

• Strong Bonding to Difficult Metallic Substrates
• 90-Minute 75 deg C Cure
• 1.0 x 10^13 ohm-cm Volume Resistivity

ABLESTIK 2958

• Electrically Conductive Bonding
• 40,000 mPa s Mixed Viscosity
• 15-Minute 100 deg C Cure

ABLESTIK 369-3

• 0.0005 ohm-cm Volume Resistivity
• 4-Hour 74 deg C Cure
• Two-Hour Working Window

ABLESTIK 506

• Flexible Cured Adhesive
• 0.9 W/(m K) Thermal Conductivity
• Reworkable Bonding Material

ABLESTIK 550

• Film-Format Bonding for Difficult Surfaces
• 30-Minute 150 deg C Cure
• 39 N/mm^2 Aluminum Lap Shear

ABLESTIK 568

• 2.5 x 10^14 ohm-cm Volume Resistivity
• 2-Hour 95 deg C Cure
• 3 mil Glass-Fabric-Supported Film

ABLESTIK 59C

• 7 W/(m K) Thermal Conductivity
• 55 to 260 deg C Service Range
• Reworkable Bonding Material

ABLESTIK 60L

• 50 ohm-cm Volume Resistivity
• 30-Minute 25 deg C Cure
• 55 to 130 deg C Service Range

ABLESTIK 77-1S

• One-Component, Solvent-Free Epoxy for Attaching Surface-Mounted Devices
• Smooth Non-Tailing Non-Sag Consistency
• 91-Day Working Window

ABLESTIK 77-2LTC

• One-Component, Solvent-Free Epoxy for Attaching Surface-Mount Devices
• Smooth Non-Tailing Non-Sag Consistency
• 2.5 x 10^14 ohm-cm Volume Resistivity

ABLESTIK 816H01

• 2.0 W/(m K) Thermal Interface
• Three-Hour Working Window
• Room-Temperature Thermal Interface Cure

ABLESTIK 8380

• Reduced Tailing and Stringing in Smart-Card Assembly
• 1-Minute 150 deg C Cure
• 0.0005 ohm-cm Volume Resistivity

ABLESTIK 83CJ

• 0.0004 ohm-cm Volume Resistivity
• 45-Minute Working Window
• Cold-Solder-Type Electrical Connections

ABLESTIK 84-1LMINB

• 0.0001 ohm-cm Volume Resistivity
• Screen-Printable Epoxy Bonding
• 30-Minute Working Window

ABLESTIK 85-1

• Gold-Filled Conductive Die-Attach Adhesive
• 49 N/mm^2 Shear Strength
• 1-Hour 150 deg C Cure

ABLESTIK 967-3

• 2 x 10^13 ohm-cm Volume Resistivity
• 6-Hour 65 deg C Cure
• 1:1 Meter-Mix Processing

ABLESTIK 976-1

• Electrically Conductive Thermal Interface
• 2.1 W/(m K) Thermal Interface
• 1:1 Meter-Mix Processing

ABLESTIK CF3366

• 0.0003 ohm-cm Volume Resistivity
• 5.17 N/mm^2 Aluminum Lap Shear
• Flexible Cured Adhesive

ABLESTIK CT5047-2

• Conductive Bonding for Temperature-Sensitive Electrical Connections
• 24-Hour 25 deg C Cure
• 2-Hour Working Window

ABLESTIK ECF 550

• Conductive Grounding and RF-Shielding Film
• Controlled Film Processing with Flexible Supply Formats
• 20 N/mm^2 Lap Shear

ABLESTIK ECF 561E

• Electrically Conductive Bonding
• Flexible Cured Adhesive
• 1.6 W/(m K) Thermal Conductivity

ABLESTIK ECF 568

• Electrically Conductive Application
• 2-Hour 95 deg C Cure
• Sheet Stock or Die-Cut Preforms

ABLESTIK G 909

• High-Strength Structural Bonding
• Thixotropic Non-Sag Placement
• 90-Minute 100 deg C Cure

ABLESTIK KE 4238

• Conductive Bonding for Heat-Sensitive Assemblies
• 21 W/(m K) Thermal Conductivity
• 2-Hour 60 deg C Cure

ABLESTIK KS 0004

• 0.01 ohm-cm Volume Resistivity
• 2-Hour 60 deg C Cure
• Conductive Bonding and Encapsulation Utility

ABLESTIK KS 4008

• 0.01 ohm-cm Conductive Bonding
• Aircraft Static-Discharger Bonding
• Room-Temperature or Heat Cure

AEROWAX HT

• 82 to 88 deg C Melting Range
• Chemical-Resistant Selective-Plating Maskant
• UV-Detectable BIOACT-Removable Coating

ARALDITE 2021-1

• Rapid 9-Minute Strength Development
• Broad Multi-Material Bonding
• 27 MPa Aluminum Lap Shear

ARALDITE AY 8683

• Fast-Setting Polyurethane for Filter Bonding
• 15-Minute Working Window
• 475% Elongation with 100 Pli Peel

AXAREL 1000

• MIL-PRF-680 Type I Approved Cleaner
• 60 ppm Nonvolatile Residue
• Multi-Soil Manual/Immersion Cleaning

AXAREL 2000

• MIL-PRF-680 Type II Approval
• Hand-Wipe, Immersion, or Vacuum Cleaning
• Low-Odor Low-Residue Soil Removal

AXAREL 2200

• Solder/Adhesive/Flux Residue Removal
• Fast-Drying Low-Residue Cleaning
• IPA-Replacement Electronics Cleaning

AXAREL 3000

• High-Solvency Multi-Soil Cleaning
• Fast-Drying Low-Residue Precision Cleaning
• Vapor-Degreasing or Immersion Cleaning

AXAREL 32

• Water-Rinsable pH-Neutral Electronics Cleaning
• Ionic/Flux/Oil Contamination Removal
• Ambient to 71 deg C Defluxing

AXAREL 6100

• Broad Multi-Soil Solvency
• Hand-Wipe or Immersion Cleaning
• 142 deg F Flash Point

AXAREL 9100

• 96 deg C Flash Point
• Multi-Soil Cleaning Removal
• Polymer/Elastomer and Multi-Metal Compatibility

BIOACT 105

• High-Solvency Aerospace Soil Removal
• Manual-Wipe or Immersion Cleaning
• AMS 3167 Aerospace Conformance

BIOACT 108

• Targeted Aerospace Soil Removal
• Manual or Immersion Cleaning
• Multiple Aerospace Process Approvals

BIOACT 200

• Semi-Aqueous Ink/Paint/Resin Removal
• 94 deg C High Flash Point
• Immersion/Ultrasonic/Spray System Cleaning

BIOACT 280

• High-Melting Wax Removal
• 88 to 96 deg C Immersion Cleaning
• Aerospace Process Acceptance

BIOACT 280E

• High-Melting Wax Removal
• Multi-Polymer Cleaning Compatibility
• Low-Odor Low-Volatility Cleaning

BIOACT EC-78

• RMA/No-Clean/Lead-Free Flux Removal
• Low-Foaming Electronics Cleaning
• Saponifier and Corrosion-Inhibitor Formulation

BIOACT EC-7M

• USDA-Certified Cleaning Product
• Solder-Flux, Paste, Oil, and Grease Removal
• Reduced Solvent Loss

BIOACT EC-7R

• 99% USDA-Certified Biobased Cleaner
• Broad Electronics Residue Removal
• Water-Rinsable Ambient Processing

BIOACT EC-88

• Broad Inline Defluxing
• Non-Foaming High-Loading Wash Bath
• 10 to 25% Aqueous Concentration

BIOACT SC-10E

• Multi-Soil Electronics Cleaning
• Fast-Evaporating No-Rinse Cleaning
• Manual, Batch, or Immersion Cleaning

BIOACT SC-22

• Rinse-Free Immersion or Ultrasonic Cleaning
• 62 deg C Flash Point
• 0.5 mmHg Vapor Pressure

BONDERITE C-AD 4215

BONDERITE C-AK 298

• Non-Silicated Aluminum Immersion Cleaner
• Multi-Soil Removal and Free Rinsing
• 54 to 82 deg C Immersion Cleaning

BONDERITE C-AK 4215 NC-LT

• Low-Temperature Multi-Metal Cleaning
• Fuel/Hydraulic Component Cleaning
• Chromate-Free Low-Foam Noncorrosive Formulation

BONDERITE C-AK 4316

• Heat-Scale Conditioning for Multiple Alloys
• Lower-Temperature Molten-Salt Bath Processing
• Nonflammable Titration-Controlled Bath Maintenance

BONDERITE C-AK 4338LP1

• Two-Part Alkaline-Permanganate System Component
• Jet-Engine Heat-Scale Conditioning
• Liquid-Concentrate Bath Make-Up

BONDERITE C-AK 4338LP2

• High-Temperature Oxide-Scale Conditioning
• Equal-Volume Two-Liquid Mixing
• 15 to 25% Component Concentration

BONDERITE C-AK 5948-DPM

• Painted/Unpainted Aircraft Cleaning
• Nonstaining Free-Rinsing Aluminum Cleaning
• Phosphate/Chromate-Free Immersion/Ultrasonic Cleaning

BONDERITE C-AK 5948-R

BONDERITE C-AK 909

• Heavy-Soil Multi-Metal Degreasing
• Immersion or Ultrasonic Cleaning
• Caustic-Soda-Free Chelating Formulation

BONDERITE C-AK ALTREX

• Inhibited Non-Etching Aluminum Cleaning
• BAC-5749 Medium-Duty Soak Qualification
• Buffered Hard-Water Bath Control

BONDERITE C-AK ALUM

• Removal of Light Soils with Immersion Etching
• Promotes Uniform Wetting Through Low Surface Tension
• 40 to 80 deg C Service Range

BONDERITE C-AK EC

• Multi-Soil Phosphate-Line Equipment Cleaning
• Spray, Immersion, or Recirculation Cleaning
• Two-Step Descaling Bath Control

BONDERITE C-AK ETCH 9HL

• High-Copper Aluminum Chem-Mill Processing
• Controlled Immersion Chemical Milling
• Improved Line Definition and Etch Uniformity

BONDERITE C-AK LS

• Rolling-Oil Steel-Strip Cleaning
• Dip, Spray, or Electrolytic Cleaning
• Oil-Separating Emulsion Behavior

BONDERITE C-AK MIL-ETCH

• Uniform Fine Satin or Frosted Etch
• Low-Foam Low-Mist Alkaline Etching
• BAC 5786 Operating Conditions

BONDERITE C-AK VITKL

• Ferrous/Titanium Tenacious-Soil Removal
• Boeing BAC 5749 Compliance
• Low-Foaming Quick-Rinse Bath Control

BONDERITE C-IC 2310

• Chromium-Free Aluminum Deoxidizing Cleaner
• No-Heat Immersion/Spray Cleaning
• MIL-W-6858C Deoxidizing Compliance

BONDERITE C-IC 33

• Non-Flammable Bonding Formulation
• Brush, Spray, or Immersion Application
• Adhesion-Promoting Surface Treatment

BONDERITE C-IC 4409

• Ferrous/Nonferrous Alloy Cleaning and Deoxidizing
• Hand-Wipe, Immersion, or Spray Processing
• Water/Steam-Rinsable Rust Removal

BONDERITE C-IC 457

• Heavy-Oxidation Aluminum/Magnesium Deoxidizing
• Non-Flammable Phosphate-Free Formulation
• Pre-Paint Surface Conditioning

BONDERITE C-IC 79

• Phosphoric-Acid Oxidation/Corrosion Cleaner
• Brush, Immersion, or Spray Application
• Pre-Paint/Conversion-Coating Surface Preparation

BONDERITE C-IC ALDOX

• Chromate-Free Aluminum Deoxidizing and Desmutting
• Boeing BAC 5765 Qualification
• Ambient Spray or Immersion Processing

BONDERITE C-IC SMUTGO

• Chromate-Free Acid Cleaner
• Ambient Immersion or Spray Processing
• Low Electrical Surface Resistance

BONDERITE C-SO 2382

• Aerospace NESHAP/AQMD Solvent Compliance
• Fast-Evaporating Residue-Free Surface Prep
• Noncorrosive Ferrous/Nonferrous Metal Cleaning

BONDERITE L-FG LS 2127

• Up to 1649 deg C Service
• Anti-Stick Non-Ferrous Tooling Coating
• Brush, Spray, or Dip Application

BONDERITE L-FM PRETREAT

• Heat-Treatment Scale Inhibition
• Lubricating Protective Forming Coating
• Fast-Drying Post-Treatment Descaling Aid

BONDERITE L-GP 460

• High-Purity Graphite Anti-Seize Lubricant
• High-Load Extreme-Pressure Lubrication
• Up to 538 deg C Service

BONDERITE M-CR 1001

• Clear Aluminum Chromate Conversion Coating
• Paint-Adhesion and Corrosion-Resistance Improvement
• Spray or Immersion Application

BONDERITE M-ED 1000

• Nickel Acetate-Based Sealing Process
• Reduced Smut, Powdering, and Yellowing
• Commercial and Selected Military Anodizing Seal Processes

BONDERITE M-FE 101

• One-Step Steel Cleaning and Phosphating
• Improved Paint Adhesion, Coating Durability, and Corrosion Resistance
• Steam Gun and High-Pressure Manual Applications

BONDERITE M-FE HMF-1080

• Heavy-Metal-Free Multi-Metal Clean/Phosphate Process
• Improved Paint Adhesion and Corrosion Resistance
• Multi-Metal Spray-Tunnel Pretreatment

BONDERITE M-MN LUBRITE 2

• Oil-Absorptive Phosphate Lubricating Coating
• Rapid Break-In and Reduced Scuffing
• Corrosion-Resistant Oil-Finishing Surface

BONDERITE S-FN 309

• Fast-Drying PTFE Dry-Film Lubrication
• Wood/Metal/Rubber/Plastic/Glass Surface Adhesion
• Spray/Brush/Dip/Roller Application Methods

BONDERITE S-FN 310A

• PTFE Dry-Film Low-Friction Release
• Longer Wear Life than Pure PTFE
• 149 deg C Low-Temperature Cure

BONDERITE S-FN 330

• Low-Friction Stick-Slip-Resistant Coating
• 500-Hour Salt-Spray/Humidity Resistance
• Up to 150 deg C Service

BONDERITE S-FN 333

BONDERITE S-FN GP 1904

• PTFE/Graphite Dry-Film Lubricant
• Corrosion and Solvent Resistance
• Multi-Substrate Dry Lubrication

BONDERITE S-OT 310B

• PTFE Dry-Film Low-Friction Lubrication
• Oil, Solvent, and Chemical Resistance
• Metal and Rubber Coating Process

BONDERITE S-ST 5351

• Ambient-Temperature Aerospace Coating Removal
• Viscous Vertical-Surface Stripping
• MIL-R-81294 Aerospace Approval

BONDERITE S-ST 5668

• Aircraft Polyurethane/Epoxy Coating Removal
• Phenol-, Chromate-, Solvent-, and Acid-Free Formulation
• MIL-R-83936B Specification Compliance

BOSTIK 1100 FS

• 90-Minute Tack-Free Time
• Plastic-to-Wood Urethane Bonding
• +/-25% Joint Movement Capability and Temperature Resistance

BOSTIK 70-01A

• Permanently Elastic SMP Sealant with Temperature Resistance
• Primerless Glass-to-Metal Bonding
• Solvent-, Isocyanate-, and PVC-Free Formulation

BOSTIK 70-03A

• 2.5 MPa Lap Shear
• Primerless Multi-Substrate Adhesion
• Up to 120 deg C Service

BOSTIK 70-05A

• High-Strength Structural SMP Bonding
• Primerless Multi-Substrate Adhesion
• UV and Weather Resistance

BOSTIK 70-08A

• High-Green-Strength SMP Adhesive
• Primerless Glass Bonding
• Solvent-, Isocyanate-, and PVC-Free Formulation

BOSTIK 920

• Flexible Cured Adhesive
• Above- and Below-the-Waterline Sealing and Bonding
• Plastic, Wood, and FRP Bonding

BOSTIK 940FS

• 10-Minute Cure Cycle
• Adhesion and Mechanical Performance of Polyurethane
• Primerless Glass-to-Aluminum Bonding

BOSTIK BOSCODUR

• Solvent-Resistant Urethane Bonding
• Effective Cross-Linker for Nitrile
• 4 to 6-Hour Working Window

BOSTIK ISR70-03A

• Primerless Elastic Silyl-Modified-Polymer Bonding
• Solvent-, Isocyanate-, and PVC-Free Formulation
• Transportation and Industrial Assembly Bonding

BOSTIK L1096MR

• One- or Two-Component Contact Adhesive
• Fast Tack and Heat Resistance
• Multi-Substrate Brush/Knife/Roll-Coat Application

BOSTIK L4045

• Fast-Drying One-Part Nitrile Adhesive
• Non-Staining Bonding Formulation
• Flexible Cured Adhesive

BOSTIK L4145

• One-Part No-Curative Nitrile Adhesive
• Oil, Water, and Plasticizer Resistance
• BMS 5-30/BAC5010 Qualification

BOSTIK L7132K

• Two-Part High-Green-Strength Laminating
• Heat- and Creep-Resistant Bonding
• BMS 5-127G Aerospace Qualification

BOSTIK L7132R

• Two-Component High-Green-Strength Laminating
• Heat- and Creep-Resistant Bonding
• Wide Vacuum-Form Processing Window

BOSTIK LADH1531AC

• Sprayable neoprene contact adhesive
• Excellent green strength
• High water, oil & heat resistance

BOSTIK STR350A

• Elastic Adhesive/Sealant Performance
• -40 to 121 deg C Service
• Primerless Multi-Substrate Adhesion

CLEANSAFE 50E

• 10% Aqueous Precision Cleaning
• Multi-Metal Cleaning and Brightening
• Above 101 deg C Flash Point

CLEANSAFE 787C

• Low-Foaming Lubrication Formulation
• Multi-Soil Cleaning Removal
• Ferrous and Non-Ferrous Alloys

CONAP DS-1831A

• 15% Red Pigment Concentrate
• Epoxy and Polyurethane System Compatibility
• Filled and Unfilled Formulation Guidance

CONATHANE MR-5002

• Low-Viscosity Silicone Mold Release
• Epoxy/Polyurethane/Polyester/Plastic Resin Release
• 10 to 15-Minute Air Dry

CONATHANE MR-5012

• Low-Viscosity Silicone Mold Release
• Epoxy/Polyurethane/Polyester Mold Compatibility
• Wipe, Brush, or Spray Application

CONAP S-1

• AD-1146/AD-1147 Primer-Reducing Solvent
• Brush, Dip, or Spray Application
• 7 deg C Flash Point

CONAP S-13

• CE-1170 Conformal-Coating Reducing Solvent
• Viscosity Adjustment and Cleanup
• 27 deg C Flash Point

CONATHANE S-8

• CONATHANE Conformal-Coating Reducing Solvent
• Dip and Spray Viscosity Adjustment
• Evaporative-Loss Makeup and Process Cleanup

COOLTHERM 6053

• Flexible Cured Material
• Heat & Oxidation Resistance
• Supplied in a 16-Ounce Aerosol Format

COOLTHERM 6250

• 350 cP Low-Viscosity Curing Agent
• High-Solids Adhesive/Encapsulation Curing Agent
• Chemical-Resistant Cured Epoxy Systems

COOLTHERM 6732

• Hardener Component Thermal Interface Material
• 100:0.5 Controlled Mixing
• Thermally Conductive Thermal Interface

COOLTHERM 6733

• Solvent-Free RTV Silicone Encapsulation
• Low-Stress No-Exotherm Room-Temperature Cure
• -60 to 205 deg C Continuous Service

COOLTHERM EP-6010

• 55 cP Application Viscosity
• Low-Shrinkage Epoxy Curing Agent
• Two-Year Shelf Life at 25 deg C

COOLTHERM MD-140

• 12 W/(m K) Thermal Conductivity
• 72-Hour Working Window
• Fast 120 to 180 deg C Cure

COOLTHERM PC10882

• Screen-Printable Coating Application
• Thermal-Shock and Solvent-Resistant Cured Film
• Above 500 V/mil Dielectric Strength

COOLTHERM SC-6730

• Room-Temperature Thick-Section Cure
• 3.0 to 10.0% Mix Concentration
• Blue-Green Visual Mix Indicator

CYBERBOND 2241

• Toughened Structural Bonding
• Metal, Plastic, and Rubber Bonding
• Up to 140 deg C Service

DEVCON FLEXANE 94

• 6,000 cP Castable Urethane
• Replacement-Part and Flexible-Mold Fabrication
• 19.3 MPa Cured Tensile Strength

DOWSIL 20

• Heat-Stable Non-Carbonizing Parting Film
• Solvent-Dilutable Release Formulation
• Plastic/Adhesive/Elastomer Product Applications

DOWSIL 3-6548

• Fire-Resistant RTV Silicone Foam
• 2x to 4x Liquid-Volume Expansion
• Flexible Medium-Density Ozone/UV-Resistant Foam

DOWSIL 3-6559

• Adjustable 1 to 5 Wt% Addition Level
• 4 to 12-Hour Cure Window
• Surface/Environment Cure-Inhibition Management

DOWSIL 510

• Available in Four Viscosities
• High-Temperature Fluid Stability
• Low-Volatility Process Fluid